eMMC is an embedded storage solution in Ball Grid Array (BGA) package. Designed with eMMC 5.1 interface, HS400 speed and low power consumption, eMMC is the ideal embedded storage choice for harsh environment industrial applications. We offer eMMC in MLC with Program Erase Cycles of 3,000 and support Industrial as well as Automotive AEC-Q100 Grade 3 and Grade 2.  

Highlights

• Phison Controller
• Kioxia/Toshiba BiSC 3D NAND Flash
• Multi Level Cell (MLC)
• eMMC (153 ball) 5.1 Interface
• Vccq = 1.8V/3.3V (Automotive AEC-Q100 Grade 2 only supports Vccq 1.8V)
• Vcc = 3.3V
• Package Size FBGA153 11.5x13.0x1.0mm
• Support three different data bus widths: 1 bit (default), 4 bit, 8 bit
• Data transfer rate: up to 52Mbyte/s (using 8 parallel data lines at 52 MHz)
• Single Data Rate: up to 200Mbyte/s @ 200MHz
• Double Data Rate: up to 400Mbyte/s @ 200MHz
• Read/Write Sequential: 280/140MB/s
• Power Consumption Active/Idle: < 210/100 mA
• ECC Correction
• Sudden Power-Loss Data Protection
• Support Secure Erase
• Field Firmware Update (FFU), Power Off Notification,
• Cache Flushing Report, BKOPS Control, Cache Barrier, RPMB Throughput Improve, 
• Bad Block Management
• AutoRefresh
• Weight <1g
• Industrial Temperature: -40°C ~ 85°C
• Automotive AES-Q100 Grade 3: -40°C ~ 85°C
• Automotive AES-Q100 Grade 2: -40°C ~ 105°C 
• 3 Year Limited Warranty
• Built in Taiwan

Note: Temperature surface (Tc) cannot exceed 115°C.

Contact us for Automotive Grade 2 and 3 Options