Product Specifications

Series

M230 M.2 PCIe Module

Interface / Form Factor

NVMe Gen3 X2 / M.2 2230

Capacity

64GB ~ 512GB

NAND Flash

3DTLC BiSC3

Performance (R/W)

Up to 1600MB/s Read

Up to 800MB/s Write

TBW (Total Bytes Written)

128GB: 170TB; 256GB: 380TB

512GB: 800TB; 1TB: 1665TB; 2TB: 3115TB

Low Power Consumption (Active/Idle)

7200/910 mA

Support Power Saving Modes APST, ASPM, L1.2

ECC Engine

LDPC

Feature Support

Thermal Management, End-to-End Data Path Protection, Smart Refresh, Support HMB

Security

Security Erase, TCG OPAL

Optional Feature

Industrial Temp -40°C ~ 85°C, Over Provisioning, TCG OPAL

Temperature

Standard Operating: 0°C ~ 70°C

Industrial Temperature: -40°C ~ 85°C

Storage: -40°C ~ 85°C

Environmental

Humidity: 5% ~ 95%

Shock: 1,500G/0.5ms

Vibration: 80~2000Hz/20G

Dimensions

30 x 22 x 1.5mm

Warranty

Limited 3 Years